SM'04

Advanced call for papers for the

ACM Symposium on Solid Modeling and Applications


Genova, Italy, June 9-11, 2004

Part of the

International Convention on Shapes & Solids 2004


The ACM Solid Modeling Symposium is an international forum for the exchange of recent results of research and application of solid modeling, geometric modeling, and geometric computation in design, analysis and manufacturing, as well as in biomedical, geophysical and other application areas. Since 1991, this highly successful event brings together prominent researchers, key practitioners, and students in the field.  The symposium is held annually since 2002, alternating its location between the USA and other countries.

In 2004, the ACM Symposium on Solid Modeling and Applications (SM) will immediately follow the Shape Modeling International (SMI) conference, with a one-day overlap and common program on Wednesday June 9. Both will be part of the International Convention on Shapes & Solids 2004 (abbreviated SMI&SM04) to take place June 7-11, 2004 in the Palazzo Ducale, situated in the historical part of Genova, Italy, which together with the nearby Antique Harbor, will host much of the international artistic programs that will flock to Genova, which is the Capital of European Culture for 2004.

The joint Convention is Chaired by Bianca Falcidieno (CNR, Italy). Information regarding this unique event may be found at http://smism04.ge.imati.cnr.it, along with registration guidelines and hotel reservations. In addition to technical papers in plenary sessions, the program for Solid Modeling and Applications 2004 will include:

The papers submission schedule is as follows

For details on how to submit abstracts and papers, please consult the web page http://www.ce.washington.edu/sm04.


Topics of interest for Solid Modeling 2004 include, but are not limited to:

Abstracts are requested in advance to facilitate the review process and should be 150-300 words in length.  Papers are limited to 12 typeset pages, including figures and references, and should present previously unpublished original results that are not simultaneously submitted elsewhere.  All papers will be peer-reviewed. Papers accepted as full technical contributions will be presented during the plenary sessions and will appear in the conference proceedings published by ACM Press. Other papers may be selected for presentation at the emerging technology or poster session and will be published in the proceedings as extended abstracts.  A revised version of selected papers will also be published in special issues of related scientific journals.

Symposium Co-Chairs:
Pere Brunet, UPC, Barcelona, Spain
Nicholas Patrikalakis, MIT, Cambridge, USA

Program Co-Chairs:
Gershon Elber,  Technion, Israel
Gabriel Taubin, Brown University, USA